I am posting this on behalf of my friend. I am interested to find the temperature distribution of a meander structure. The process of joule heating is involved in here. A 31 *31 sq mm area is the wafer coupon. A 675 um thick Silicon substrate over which a 1000 nm thick Silicon dioxide is fabricated . over the Sio2 is the Copper meander [url removed, login to view] thickness of 500 nm. voltage of 25 V is applied to either ends of the contacts. And a temperature in excess of 320 degrees is observed. It was seen practically in the FLIR thermal imaging camera with the voltage increased gradually that the temperature distribution in the meander was good.
This is a transient heat distribution from the thermal camera as in the picture below.. I have already modeled the same although in stationary(time independent distribution) in comsol. The temperature distribution is almost similar, however an unrealistic temperature is being observed in the model. I have considered a natural convection above and below the wafer surface. So assuming the structure dangling in open air (Similar to the FLIR camera), the temperature should be around 350-360 degrees C max on the [url removed, login to view] a Voltage of 25V was used with a current of 3A. So total power of 75 W.
I need someone who can explain what the error is and also fix the issue in my [url removed, login to view], i need to find the losses because of heat conduction through the layers in comsol. Any one with modelling or mechanical/thermodynamic knowledge should be able to take a maximum of 10 minutes for this work. I am attaching the files of my model in comsol (v5.3) and also the Thermal imaging camera for reference